J.Bond Technology Co., Ltd.
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Contact Information
Company Name: J.Bond Technology Co., Ltd. 
Contact Person: Mr. Dylan Yi 
Company Address: China (Mainland) B510, Block 2, Seg Technology Industrial Park, Huaqiang Norther Road. Futian District 
Zip:  
Telephone: 86-755-83768216 
Fax: 86-755-83765595 
Mobile Phone:  
Website: http://us.trade15.com/co-308330.html